Appeal No. 2004-0748 Page 7
Application No. 09/427,226
be placed onto a simply constructed printed board. Figure 12 is a side view of one
embodiment of the stack arrangement for two semiconductor memory chips, prior to the
folding of the flexible carrier film and Figure 13 is a side view of that stack arrangement
subsequent to the folding of the flexible carrier film. As shown in Figure 12, the stack
arrangement includes a flexible carrier film TF2 and two semiconductor memory chips
HSC. Hacke teaches (column 5, line 56, to column 6, line 4) that:
All the inner terminals IA are placed on one side of the carrier film TF2.
Essentially both groups of conductors also extend on this side, of which only the
conductors L1 can be seen in FIG. 12. The individual conductors are fed to the
other side of the carrier film TF2 via throughplatings D1 only in the case of a
transposition. It can also be seen in FIG. 12 that the two semiconductor memory
chips HSC are bonded to the allocated inner terminals IA in face-down position. It
is important that all the conductors are fed together via the strip-shaped bonding
region referenced KB2, so that the outer contacts AK are formed subsequent to
the folding about the elastic line BL2 according to FIG. 13. Given the folding
direction indicated by an arrow PF1 in FIG. 12, in the finished stack arrangement
according to FIG. 13, the two semiconductor memory chips HSC are situated on
opposite outer sides of the stack.
The appellants argue (brief, pp. 4-5) that Hacke does not disclose mounting a
first die into a first package; mounting a second die into a second package; and
electrically coupling the first package to the second package to form a stacked device.
We agree. In our view, the stack arrangement for two semiconductor memory chips
shown in Figure 12 of Hacke constitutes only a single package and not first and second
packages especially since the two semiconductor memory chips HSC are connected
together prior to folding into the finished stack arrangement. In that regard, the
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