Appeal No. 2004-1015
Application No. 09/619,869
adapted to connect a microprocessor chip to the printed circuit
board;
a chip/thermal interface pad/heat sink sub-assembly
including:
a microprocessor chip connected to the socket of the printed
circuit board by the actuator;
a heat sink thermally coupled to the top surface of the
microprocessor chip, the heat sink being positioned with respect
to the printed circuit board as a function of the coarse
alignment features; and
a thermal interface pad positioned between the heat sink and
the microprocessor chip.
9. A method of assembling a printed circuit board assembly
comprising:
attaching a socket and actuator to the printed circuit
board;
positioning a microprocessor chip on the socket;
actuating the actuator to secure the chip to the printed
circuit board;
placing a phase change material thermal interface pad on the
top surface of the chip;
placing a heat sink on the top surface of the phase change
material thermal interface pad; and
aligning and securing the heat sink with respect to the
printed circuit board, wherein alignment of the heat sink with
respect to the microprocessor chip is not necessary.
14. A method of disassembling and re-assembling a printed
circuit board assembly comprising:
actuating an actuator of a socket attached to a printed
circuit board, the socket securing a first chip, a first thermal
interface pad, and a heat sink to the chip;
removing the first chip, the first thermal interface pad,
and the heat sink from the socket as a unit;
separating the first chip from the heat sink;
disposing the first chip and the first thermal interface
pad;
positioning a second chip on the socket;
actuating the actuator to secure the second chip to the
printed circuit board;
positioning a second thermal interface pad on the top
surface of the second chip;
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Last modified: November 3, 2007