Appeal No. 2004-1015
Application No. 09/619,869
board, a cam mechanism 120 for actuating the ZIF socket, an
electronic package 20 including a microprocessor chip 22 received
by the ZIF socket, a heat sink 30 composed of a base plate 32 and
cooling fins 34 mounted on the electronic package, and a retainer
clip 70 for securing the heat sink and the electronic package to
the ZIF socket. The arrangement also may include a thermal
interface material disposed between the heat sink and the
electronic package to facilitate thermal coupling and transfer
between the two (see column 5, lines 21 through 25). To assemble
these components, the electronic package is installed on the ZIF
socket, a thermal interface material optionally is placed on the
electronic package, the heat sink is disposed on the electronic
package or the thermal interface material, and the retainer clip
is applied to secure the heat sink and the package to the socket
(see column 5, lines 26 through 62). In an alternate embodiment,
Jones replaces the retainer clip 70 with alignment and retention
pins 38 projecting downwardly from the heat sink for insertion
into clearance openings 28 in the electronic package and
corresponding retention grooves 130 in the socket.
According to the examiner (see page 3 in Paper No. 14),
Jones responds to all of the limitations in independent claim 1
except for those requiring (1) the thermal interface pad, (2) the
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Last modified: November 3, 2007