Appeal No. 2004-1015
Application No. 09/619,869
printed circuit board to have coarse alignment features and (3)
the heat sink to be positioned with respect to the printed
circuit board as a function of the coarse alignment features.
Implicit in the examiner’s analysis is that Jones also responds
to all of the limitations in independent claims 9 and 14 except
for those in claim 9 pertaining to (1) the thermal interface pad
and (2) the step of aligning and securing the heat sink with
respect to the printed circuit board wherein alignment of the
heat sink with respect to the microprocessor chip is not
necessary, and those in claim 14 relating to (1) the first and
second thermal interface pads and (2) the steps of positioning
the heat sink on the top surface of the second thermal interface
pad wherein alignment of the heat sink with respect to the second
chip is not necessary and securing the heat sink to the printed
circuit board. To supply these deficiencies in Jones, the
examiner turns to Gonsalves.
Gonsalves discloses an arrangement comprising a circuit
board 50, a plurality of heat generating components 10-1 through
10-7 (e.g., integrated circuits) mounted on the circuit board, a
resilient thermal conductive filling material 40 or a thermal
phase change material 100 disposed on the components, a heat sink
30 mounted over these materials, and screws 60-1 and 60-2 for
5
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