Appeal No. 2004-1015
Application No. 09/619,869
positioning the heat sink on the top surface of the second
thermal interface pad, wherein alignment of the heat sink with
respect to the second chip is not necessary; and
securing the heat sink to the printed circuit board.
THE PRIOR ART
The references relied on by the examiner as evidence of
obviousness are:
Gonsalves et al. (Gonsalves) 6,212,074 Apr. 3, 2001
Jones 6,219,241 Apr. 17, 2001
THE REJECTION
Claims 1 through 16 and 18 through 20 stand rejected under
35 U.S.C. § 103(a) as being unpatentable over Jones in view of
Gonsalves.
Attention is directed to the brief (Paper No. 17) and to the
Office action dated July 22, 2002 and the answer (Paper Nos. 14
and 20) for the respective positions of the appellant and the
examiner regarding the merits of this rejection.1
DISCUSSION
Jones, the examiner’s primary reference, discloses an
arrangement comprising a printed circuit board 2, a ZIF (zero-
insertion-force) socket 10 solder mounted to the printed circuit
1 In the noted Office action, claims 2 and 6 also stood
rejected under 35 U.S.C. § 112, second paragraph, as being
indefinite. The examiner has since withdrawn this rejection (see
pages 2 and 3 in the answer).
3
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