Appeal No. 2004-1015
Application No. 09/619,869
alignment features [Jones’ pins 38] and coarse alignment features
[Gonsalves’ screws 60 and bolster plates 65] . . . [which]
Applicant specifically teaches away from” (brief, page 6) and
that “any combination of Jones and Gonsalves would not allow a
release of an individual chip from a socket for field
replacement” (brief, page 6).
The appellant’s position here is persuasive in some respects
but not in others.
To begin with, none of claims 1, 9 and 14 excludes fine
alignment features such as the pins 38 disclosed by Jones, which
pins are not even present in one of the Jones embodiments focused
on by the examiner. In the same vein, none of these claims
requires the release of only one individual chip from a socket
for field replacement. As modified in view of Gonsalves to
include screws 60 and bolster plates 65 for aligning and
connecting the heat sink to the printed circuit board, the Jones
arrangement meets all of the limitations actually set forth in
claims 1 and 9, with the screws and bolster plates (1) embodying
coarse alignment features whereby the heat sink is positioned
with respect to the printed circuit board as a function of such
features as recited in claim 1, and (2) functioning to align and
secure the heat sink with respect to the printed circuit board
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