Appeal No. 2006-0367
Application No. 10/353,506
Here, we have found that Forester describes a dense, uniform coating as
advantageous. (FOFs 23-24.) We have further found that the electron beam
processing described by Forester offers additional advantages of a lower dielectric
constant and a reduction in time and temperature for processing. (Id.) We have also
found that these advantages would have motivated one skilled in the art to use an
electron-beam to process a semiconductor structure that includes a dielectric cover.
(Id., 24.)
2. MOTIVATION TO COMBINE TEACHINGS OF KOHL AND CHANG
The appellants argue that "there is no reason to densify in this specific case
based on anything pointed to in the Chang reference." (Appeal Br. at 10.)
We have found that Chang identifies a problem with porous insulators, (FOF 28),
and describes a solution to that problem, viz., a plasma treatment. (FOF 29.) We have
also found that Chang explains that plasma treatment of an insulator offers the
advantages of a denser insulator, which provides good structural support for integration
and resists moisture and other chemicals that can corrode metal lines. (FOF 30.) We
have further found that these advantages would have motivated one skilled in the art to
use an electron-beam to process a semiconductor structure that includes a dielectric
cover. (Id.)
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