Appeal No. 2006-0367
Application No. 10/353,506
19. "The permanent dielectric layer may be deposited by spin coating. . . ." Id. at
ll. 14-15.
20. "The sacrificial material 30 is removed through the permanent dielectric
layer 36 to form the air gaps 38 as shown in FIG. 2F. The removal of the
sacrificial material is . . . accomplished by thermal decomposition and passage of one or
more of the decomposition products through the permanent dielectric layer 36 by
diffusion." Id. at ll. 28-33.
21. Kohl does not expressly mention densifying its permanent dielectric
cover 36.
22. Forester is prior art under 35 U.S.C. § 102(e).
23. No attempt has been made to antedate Forester.
24. Forester "relates to electron-beam processed films for microelectronics
structures, such as integrated circuits ('IC'). More particularly, [its] invention relates to
an improvement in the method of processing such films which results in uniform, dense
films, some of which also possess a low dielectric constant and a low wet etch rate."
Col. 1, ll. 13-18.
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