Appeal No. 2006-0367
Application No. 10/353,506
25. "The electron-beam processed films of [Forester's] invention not only
advantageously form a dense, uniform coating on substrates, but also electron
beam cured SOG films possess a dielectric constant which is significantly lower
than that reported for similar compositions which were thermally treated at high
temperatures. Moreover, the time and temperature for processing such films is
significantly reduced." Col. 3, ll. 26-32 (emphasis added).
26. Because Kohl describes a semiconductor structure that includes a
permanent dielectric cover 36; and Forester explains that processing with an electron-
beam offers the advantages of a more dense, uniform coating, a lower dielectric
constant, and a reduction in time and temperature for processing; one skilled in the art
would have been motivated to use an electron-beam to process a semiconductor
structure that includes a permanent dielectric cover.
27. A person of ordinary skill in the art would have recognized that such
processing would have made the permanent dielectric cover more dense.
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