Appeal No. 2006-2344
Application No. 10/408,890
Invention
Appellants’ invention relates generally to a measurement module (figure 1) integrated in a
wafer production system to measure the surface of a wafer (4). The measurement module
includes a measuring device and a measuring table (2) having a cup-shaped wafer table (10)
equipped with a rotary drive (11). The wafer table (10) is also equipped with one or more
support edges (13, 14) for a wafer (4) having adhesive material (15a, 15b) therein. The wafer
table is configured in such a way that a wafer alignment device is arranged interiorly therein, and
a displaceable measuring head (7) is arranged over the wafer table (10) to thereby integrate a
measuring device and a notch (20).
Claim 1 is representative of the claimed invention and is reproduced as follows:
1. A measurement module for measuring particularly the surface of wafers, comprising: a
measuring device and a measuring table that has a wafer table equipped with a rotary drive,
wherein the wafer table is cup-shaped and has at least one support edge for a wafer, which is
provided with an adhesive material, wherein in an interior of the wafer table a wafer alignment
device is arranged, and wherein over the wafer table, a displaceable measuring head is arranged
in which a measuring device and a notch detector are integrated.
References
The Examiner relies on the following references:
Akimoto et al. (Akimoto) 6,126,703 Oct. 3, 2000
Subramanian 6,374,149 Apr. 16, 2002
(filed on May. 18, 1998)
Pedersen et al. (Pedersen) 6,773,560 Aug. 10, 2004
(filed on Mar. 30, 2001)
2
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