Appeal 2006-3124
Application 10/251,179
INTRODUCTION
The invention is directed to an apparatus and method for reducing
polymer deposition on a substrate and substrate support. A prior art apparatus
is illustrated in Figure 1 below:
Figure 1 shows the vertical gap 30 between a surrounding ring 16 and the
overhanging substrate edge in the prior art device. Para. [0012]. The gap 30
is said to prevent the overhanging edge of the substrate from being lifted and
thereby avoid a reduction in clamping force applied by the substrate holder
14. Para. [0011]. The Specification states that a drawback of the clearance
gap 30 is that it provides additional opportunity for polymer buildup which
may flake off and contaminate the substrate S or the electrostatic chuck 14'.
2
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