Appeal 2006-3124
Application 10/251,179
(citing Koike, col. 1, ll. 11-25 and co1. 2, ll. 32-36) and 6 (citing Fukuyama,
Abstract).
Figure 1 of Koike is illustrated below.
Koike Figure 1 illustrates a plasma etching apparatus. A focus ring 4 is
disposed around the circumference of the substrate 3 for controlling plasma
deposition. Koike, col. 2, ll. 32-35. Drive mechanism 6 is used to adjust the
height of the focus ring 4. Id. l. 43.
Figure 1 of Fukuyama is shown below.
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