Ex Parte Eidson et al - Page 7


             Appeal 2007-1098                                                                                 
             Application 10/026,059                                                                           
         1         Regarding structure that surrounds an enclosure and which reduces thermal                  
         2   drift by increasing thermal mass, the applicants’ specification discloses only two               
         3   embodiments, a metal case and a ceramic case (Specification 6: 15-21; 7: 29-31).                 
         4   Copper or aluminum are named as examples of the material used for the metal case                 
         5   (Specification 6: 18-19).  To meet the claim limitation of structure that surrounds              
         6   an enclosure and which reduces thermal drift by increasing thermal mass, the                     
         7   Examiner relies on potting material 46 used in Luce to encapsulate an electronic                 
         8   liquid crystal display cell 95.  In column 4, lines 53-56, Luce states:  “Still another          
         9   sealing means (shown as dotted lines in FIG. 2) which may be used together with                  
        10   or independently of the aforementioned seals is a complete encapsulation of the                  
        11   device with a potting material 46.”  The Examiner made no explanation, however,                  
        12   as to why Luce’s potting material 46, when used to encapsulate the liquid crystal                
        13   display cell 95, should be regarded as equivalent to the metal or ceramic casing                 
        14   discussed in the applicants’ specification.  The Examiner has not established to                 
        15   what extent does Luce’s potting material act like metal or ceramic casing.                       
        16         The Examiner states (Answer 3):   “It would have been obvious for the                      
        17   structure [potting material] disclosed by Luce et al. to reduce thermal/drift/increase           
        18   thermal mass since a larger area for heat dissipation [is] provided.”  The sentence              
        19   is unintelligible, as it suggests that the potting material itself has a mind and would          
        20   like to do a self transformation.  We take the expression to mean that one with                  
        21   ordinary skill in the art would have recognized that Luce’s potting material                     
        22   inherently absorbs some heat from the electronic component.  In that regard, the                 
        23   Examiner finds that the heat absorbing capability of a typical potting compound is               
        24   greater than that of the atmosphere.  Although that determination has not been                   
        25   disputed by the applicants, it is not sufficient justification to conclude that Luce’s           
        26   potting material is “equivalent” to a metal or ceramic casing for purposes of                    


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