Appeal 2007-1104
Application 09/962,697
Appellants invented a system for manufacturing an integrated circuit
(IC) (1) having a plurality of contact pads (11) on which electrically
conductive bumps (2) and elevations (10) are disposed. The IC (1) is
applied to the base of a substrate (4). Subsequently, a plastic material (3) is
used to encapsulate the IC (1). (Specification 4.)
Claim 13 is illustrative of the claimed invention. It reads as follows:
13. A component, comprising:
an integrated circuit having an active main side with contact pads
disposed on said active main side;
electrically conductive bumps having a height and being connected to
said contact pads;
a plurality of electrically conductive elevations commonly formed and
separated from a base substrate, said electrically conductive elevations
connected to said electrically conductive bumps, and said electrically
conductive elevations having a height greater than said height of said
electrically conductive bumps;
a sealing compound encapsulating said integrated circuit, said
electrically conductive bumps and parts of said electrically conductive
elevations resulting in an encapsulated component having an underside, said
electrically conductive elevations encapsulated in said sealing compound
being accessible on said underside of said encapsulated component and
forming external contacts with anchor means anchored in said sealing
compound.
In rejecting the claims on appeal, the Examiner relied upon the
following prior art:
Fukutomi US 5,976,912 Nov. 2, 1999
Jung US 6,495,909 B1 Dec. 17, 2002
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