Appeal 2007-1104
Application 09/962,697
FINDINGS OF FACT
The following findings of fact are supported by a preponderance of the
evidence.
The invention
1. Appellants invented a system for manufacturing an IC (1) having a
plurality of contact pads (11) whereupon electrically conductive bumps (2)
are applied. (Specification 10.)
2. Each electrically conductive bump (2) is subsequently connected to an
electrically conductive elevation (10) disposed on the base of the substrate.
(Id. 14.)
3. The electrically conductive elevations (10) are constructed to have a
T-shape or a trapezoidal cross section. (Id.)
4. As depicted in figure 10, each elevation appears from the original
drawings to have a height greater than the height of the electrically
conductive bump connected thereto (2).2
5. The electrically conductive elevations (10) appear from the original
drawings to be commonly formed and separated from the base substrate.3
2 We note that Appellants’ original Specification does not discuss the
characteristics of the electrically conductive elevations or bumps.
Particularly, we fail to find any discussion in the original Specification
pertaining to the elevations as being commonly formed and separated from
the substrate. Similarly, we fail to find any discussion in the original
Specification pertaining to the height of the elevations as being greater than
the height of the bumps. It appears to us that such teachings were inferred
from figures 7, and 9 through 12 of Appellants’ original drawings.
However, we have no indication on the record before us that these drawings
are drawn to scale.
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