Appeal 2007-1104
Application 09/962,697
6. The IC (1) is applied to the base of a substrate, and it is subsequently
encapsulated in a plastic material (3). (Specification 14).
The Prior Art Relied upon
7. Fukutomi teaches a system for manufacturing an LSI chip (3) having
gold bumps (8) connected to terminal portions of the wirings (2) disposed on
the base substrate (1). (Title, Abstract, col. 9, ll. 30-35.)
8. Fukutomi teaches, as depicted in figure 2B, the two wirings appear to
be commonly formed and separated from the base substrate.
9. Similarly, Fukutomi teaches, as depicted in figure 2B, the height of
the wirings (2) appears to be greater than the height of the gold bumps (8).
10. Fukutomi teaches that the LSI (3) chip is subsequently encapsulated
using epoxy resin (9). (Col. 9, ll. 35-49 ).
11. Jung teaches a method and system for manufacturing an IC (200)
coupled to T-shaped connection pads (230) through bonding wires (212)
exposed at the bottom of the package to permit contact with external
devices. (Col. 2, l. 57- col. 3, l. 7).
12. Jung teaches that the T-shaped profile of the connection pads
provides the benefit of prolonging the path and time diffusion into the
package, as well as enhancing the locking of the pads into a predetermined
place the package body. (Id.)
3 Id.
6
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