Appeal No. 96-2821
Application 08/015,007
2. Applicants filed the subject application on 9 February
1993. (Paper 1 at 1.) They claim the benefit under 35 U.S.C.
§ 119 of Japanese patent applications 4-026368, filed 13 February
1992, and 5-009106, filed 22 January 1993. (Decl. at 1.) The
real party-in-interest is Mitsubishi Denki K.K. Applicants have
not identified any other proceeding that might affect, or be
affected by, this appeal. (Paper 30 at 1.)
3. The invention is entitled "Cu/Mo/Cu CLAD MOUNTING FOR
HIGH FREQUENCY DEVICES". (Paper 10 at 1.) We presume that
"Cu/Mo/Cu" has its ordinary meaning of a copper/molybdenum/copper
laminate.
4. The subject matter of the claimed invention is a
semiconductor having a ceramic dual-in-line package (CERDIP) type
of package. (Paper 1 at 1.) According to Applicants, "with the
recent spread of data communication equipment[] using high
frequency [gallium arsenide] GaAs devices, etc., an inexpensive
semiconductor package with high heat transfer and suitable for
high frequency devices has been increasingly demanded." (Paper 1
at 2-3.) They note that cost, temperature, weight, and ability
to handle high frequencies are all problems in the art. (Paper 1
at 3.)
5. Applicants address the problems with the semiconductor
package shown in Figure 4(a). They fabricate a base plate 11
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