Appeal No. 96-2821
Application 08/015,007
exemplary listing of such metals includes alloy 42, Invar, and
molybdenum." (4:52-58, emphasis added, parentheticals omitted.)
Thus, random selection among the explicitly identified materials
would yield a one-in-six chance of selecting a Mo/Cu/Mo clad
base. Mahulikar also states that "the core layer 32 of the
composite base 12 may comprise either the high expansion
component or the low expansion component and the first and second
clad layers 34 and 36 the other component." (6:15-19.) Thus,
one would have a one-in-twelve chance of randomly selecting a
Cu/Mo/Cu clad base if one were to apply the teachings of
Mahulikar to a CERDIP system as suggested.
13. Mahulikar reports that molybdenum has drawbacks as a
material (5:50-57), but nevertheless lists it as an "exemplary"
metal (4:52-58).
14. Iversen discloses a heat sink comprising inserts 11
with substrates 10 on which semiconductor chips 38 are mounted.
(2:26-30.) The heat sink has a very different geometry than a
CERDIP-type package.
15. The substrate 10 must have a high thermal conductivity
and a TCE that matches the semiconductor chip. Iversen
recommends molybdenum, tungsten, or zirconium for the substrate
10. (2:30-39.) The substrate 10 may be any desirable shape, but
preferably has rounded corners to minimize stress on the
- vi -
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Next
Last modified: November 3, 2007