Appeal No. 96-2821
Application 08/015,007
B. Prior art
7. The examiner rejected claim 5 under 35 U.S.C. § 103 in
view of the following references (Paper 16 at 2):
Matsumoto JP (A) 1-2733371 published 1 Nov. 1989
Tokutake et al. JP (A) 3-83621 published 16 Jan. 1991
Iversen et al. 4,989,070 29 Jan. 1991
Mahulikar et al. 5,015,803 14 May 1991
A person having ordinary skill in the art would have
apprehended the facts set forth in fact findings 8 to 20 at the
time of the invention.
8. The Tokutake reference discloses a CERDIP2
semiconductor package. The base 10 is "usually composed of
conventional aluminum ceramic". (p. 3.) Leads 28 are aptly
described as dual and in-line. (Fig. 1.) A window frame 12 is
fixed to the base 10 and to a lead frame 14 using a low-melting
point glass as the adhesive 18. The lead frame is also bonded to
a cap 16 using another low-melting point glass 20. A
semiconductor chip 26 is joined to the base 10. (p.6.)
1 A copy of the English translation of this reference is
attached. All references in this decision are to the translation
unless otherwise indicated.
2 The translator consistently mistransliterates
";0C^(/L_" (e.g., claim 1, line 2, in the original Japanese kokai
application) as "therdip" instead of "CERDIP" throughout the
translation.
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