Appeal No. 96-2821
Application 08/015,007
9. Tokutake discloses neither the use of a Cu/Mo/Cu-clad
base plate nor the thickness or dielectric constant for the
adhesive 18. Tokutake also uses a somewhat different ordering of
the components.
10. The Mahulikar reference is concerned with semiconductor
chip packages also. (1:5-10.) Mahulikar notes the thermal
expansion deficiencies with CERDIP technology (2:61-68) and
proposes his metal-clad base as a solution. (2:31-47.) His
solution requires no changes in the existing manufacturing
process.
11. "In accordance with the principles of [Mahulikar's]
invention, the base 12 of the package 10 is a composite material
composed of a first metal or metal alloy core layer 32 and first
and second metal or metal alloy cladding layers 34, 36. The
criteria for selecting the composition of the core layer and the
cladding layers is that one of the metals has high thermal
conductivity and a high thermal coefficient of expansion (TCE)
and the other metal has a low thermal coefficient of expansion."
(4:23-31.)
12. The "[p]referred high thermal conductivity metals
include copper, aluminum, and alloys thereof". (4:39-46,
emphasis added, parentheticals omitted.) "The second metal is
selected to have a low thermal coefficient of expansion. An
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