Appeal No. 96-0613
Application No. 08/226,539
through 27, which are all of the claims remaining in this
application.
According to appellants, the invention is directed to a
curable molding composition comprising (A) a curable resin and
(B) an epoxy group-containing silicone resin, where component
(B) is based on T siloxane units (i.e., RSiO units), has a
3/2
controllable molecular weight, and possesses a distinct glass-
transition temperature of -90EC. to 150EC. (brief, page 2).
Claim 7 is illustrative of the subject matter on appeal and is
reproduced in an Appendix attached to this decision.
The examiner relies upon the following references as
evidence of obviousness:
Griswold et al. (Griswold) 5,279,860 Jan. 18,
1994
(filed Jul. 30,
1992)
Shiobara et al. (JPA ‘942) 56-145942 Nov. 13,
1981
(Japanese Kokai Patent Application)2
SWS Silicones Corp. (JPA ‘655) 58-053655 Aug. 20,
1986
2All citations to this reference are from the English
translation of record.
2
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