Appeal No. 96-0613
Application No. 08/226,539
(Japanese Kokai Patent Application)3
Claims 7 through 14 stand rejected under 35 U.S.C. § 103
as unpatentable over JPA ‘942 in view of Griswold (answer,
page 3). Claims 18 through 27 stand rejected under 35 U.S.C.
§ 103 as unpatentable over JPA ‘942 in view of Griswold and
JPA ‘655 (answer, page 5). We reverse both of the examiner’s
rejections for reasons which follow.
OPINION
The curable resin composition recited in appealed claim 7
consists essentially of (A) a curable resin selected from a
group of listed resins and (B) an epoxy group-containing
silicone resin of the recited general formula. The
composition of appealed claim 7 contains a proviso that 0.1 to
40 mole percent of the total silicon-bonded organic groups in
component (B) are epoxy group-containing organic groups and
component (B) has a glass-transition temperature of -90 to
150EC.
3The examiner relies on an English abstract of this
Japanese Kokai Patent Application (answer, page 3).
Appellants rely on an equivalent Canadian Patent No. 1,091,383
(brief, page 7). Any citation to this reference in this
decision will be from the Canadian Patent equivalent.
3
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