Appeal No. 96-0613
Application No. 08/226,539
APPENDIX
7. A curable resin composition consisting essentially of:
(A) 100 weight parts of a curable resin selected from the
group consisting of phenolic resins, formaldehyde resins,
xylene resins, xylene-formaldehyde resins, ketone-formaldehyde
resins, furan resins, urea resins, imide resins, melamine
resins, alkyd resins, unsaturated polyester resins, aniline
resins, sulfonamide resins, epoxy resins, and copolymer resins
from among the preceding; and
(B) 0.1 to 500 weight parts of an epoxy group-containing
silicone resin that has the general formula
(R SiO1 ) (R R SiO2 3 ) (SiO )
3/2a 2/2b 4/2 c
1 2 3
wherein R , R and R each represents a group selected from the
group consisting of an epoxy group-containing organic group
and a monovalent hydrocarbon group with the proviso that said
epoxy
group-containing organic groups comprise 0.1 to 40 mole
percent of the total silicon-bonded organic groups in said
silicone resin (B), a is a positive number, b is zero or a
positive number, c is zero or a positive number, b/a has a
value of zero to 10, c/(a + b + c) has a value of zero to
0.3 and said silicone resin (B) has a glass-transition
temperature of -90EC to 150EC.
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Last modified: November 3, 2007