Appeal No. 1997-2016 Page 2
Application No. 08/196,126
BACKGROUND
The appellants' invention relates to a method and apparatus for aligning, stacking and
bonding structured substrates (2, 3, 4) which have approximately the same surface area and at
least one of which (3) is not transparent. Each substrate is received in a first working area (10)
in a receiving means (14) which is supported on an xy-coordinate table (13) rotatable through
360 degrees and precisely positioned by means of precision drives (16). A pair of microscopes
(31, 32) are used to image alignment markings on the substrate onto image carriers (monitors
35, 36). The position and orientation of the xy-coordinate table are adjusted until the images of
the alignment marks of the substrate are aligned with cross-hairs (28, 29) on the monitor
denoting nominal positions so that the substrate may be precisely aligned relative to the nominal
positions. Each such aligned substrate is then transported by a conveying sled (23) and
deposited on a depository table (17) in a second working area (11). The positional accuracy of
the substrate during transporting is ensured by use of a fixed stop (22), which fixes the position
of the sled in relation to the alignment field when it picks up the substrate. The substrates (2,
3, 4) are deposited one upon another on the depository table, with each substrate retaining its
precise alignment achieved in the first working area, to form a substrate package (1). The
substrate package is then directed to a heating device (38) provided with means (42) for
uniform heating of the substrate package on all sides.
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