Appeal No. 1997-2016 Page 5
Application No. 08/196,126
(52, 54) are provided on prisms (56) disposed in the base (30). The marks (22, 24) of the
substrate (18) are viewed through microscopes (68) and the substrate (18) is moved by rotating
guide collars (60) until the marks (22, 24) register with the marks (52, 54). To adhere the
devices (10) to the substrate, a platen (70) which is mounted on the base (30) so that it pivots
on a pin (72) and is held against the substrate (18) by a latch (74) heats the substrate to liquefy
an eicosane layer coated on the sites (16) of the printed circuit (20) formed on the substrate.
The platen is subsequently cooled to thus cool the substrate and solidify the eicosane and adhere
the devices (10) to the substrate. The platen is heated and cooled by alternately flowing hot and
cold water through its hollow interior.
Hulderman discloses a method of making a millimeter wave device, which comprises a
circuit board (22) surrounded on both sides by air channel shims (32, 34), cover shims (38, 40)
and back plates (42, 44) held together by screws (96) passed through holes (98, 100). As seen
in Figures 11A -11F, Hulderman discloses a process for making the air channel shims (32, 34)
from shim stock (300). First, as shown in Figure 11B, photoresist layers (306, 308) are
laminated onto the shim stock. Next, two photomasks (314, 316) having transparent and
opaque portions are aligned over each other using a microscope and then bonded at one edge to
a spacer (318) to form the photomask covered assembly illustrated in Figure 11C (column 12,
lines 26-31). The photomask covered assembly is then exposed to UV light, with the opaque
areas of the photomasks blocking light to the underlying photoresist layers. The photomasks
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