Appeal No. 1997-2016 Page 6
Application No. 08/196,126
are then removed from the assembly so that the shim stock and photoresist layers can be
subjected to a development process. The areas of the photoresist layer not exposed to UV light
are dissolved and removed from the shim stock surface during the development process, while
the areas exposed to the UV light remain on the shim stock after development, as shown in
Figure 11D. The shim stock is next subjected to an etching step, wherein the portions of the
shim stock not protected by the remaining areas of the photoresist layers are etched to form an
air channel aperture (352) and hole (354). Finally, the remaining photoresist layer is removed,
leaving only the air channel shim.
Phillips discloses a step-and-repeat alignment and exposure system and method for
printing an image of a reticle onto a semiconductor wafer using a splitfield microscope (column
2, lines 39-45).
Method claim 9 recites a method of stacking a plurality of structured substrates to be
aligned with one another and connected undetachably to one another by bonding, with the
substrates having "approximately same surface area" and with at least one of the substrates
being non-transparent, comprising, inter alia, the steps of aligning the substrates in a first
working area and transporting the substrates to a second working area and depositing the
substrates one upon another to form a substrate package. Claim 10, the only other independent
claim in this application, recites an apparatus for stacking a plurality of substrates to be aligned
with one another and connected undetachably to one another by bonding, with the substrates
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