Ex parte TAGUCHI et al. - Page 1




             The opinion in support of the decision being entered today was not written
             for publication in a law journal and is not binding precedent of the Board.
                                                                 Paper No. 44         
                       UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     ____________                                     
                          BEFORE THE BOARD OF PATENT APPEALS                          
                                   AND INTERFERENCES                                  
                                     ____________                                     
                      Ex parte MITSURU TAGUCHI and KEIICHI MAEDA                      
                                     ____________                                     
                                 Appeal No. 1998-2987                                 
                              Application No. 08/250,332                              
                                     ____________                                     
                                HEARD: January 9, 2001                                
                                     ____________                                     
          Before THOMAS, GROSS, and BARRY, Administrative Patent Judges.              
          BARRY, Administrative Patent Judge.                                         



                                  DECISION ON APPEAL                                  
               This is a decision on appeal under 35 U.S.C. § 134 from                
          the  rejection of claims 22, 25, 27, and 32-35.  We reverse.                


                                     BACKGROUND                                       
               The invention at issue in this appeal relates to forming               
          metal wirings in electronic materials such as semiconductor                 
          devices.  Wirings for semiconductor devices are sometimes                   
          manufactured by forming films at a high temperature.  For                   







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