Appeal No. 1998-2987 Page 5
Application No. 08/250,332
Mori et al. (Mori), Japanese Published Application
No. 62-113421, May 1987 1
Ho et al. (Ho), Sputtered Metallurgy Process for
Electromigration Improvement of Al-Cu
Interconnections, IBM Technical Disclosure Bulletin,
Vol. 21, No. 11, Apr. 1979, at 4527-28.
Hoffman et al. (Hoffman), Individual Wafer
Metallization Utilizing Load-Locked, Close-Coupled
Conical Magnetron Sputtering, Solid State
Technology, Feb. 1981, at 105-111
Wolf et al. (Wolf), Silicon Processing for the VLSI
Era, Volume 1: Process Technology, 56-58 and 365-74
(1986).
Claims 22 and 33 stand rejected under 35 U.S.C. § 103(a)
as obvious over Yamaha in view of Thomas and Gardner, further
in view of Wolf and Hoffman. Claims 25 and 34 stand rejected
under § 103(a) as obvious over Yamaha in view of Thomas and
Gardner, further in view of Wolf and Hoffman, and further in
view of Howard. Claims 27 and 35 stand rejected under §
103(a) as obvious over Yamaha in view of Thomas and Gardner,
further in view of Wolf and Hoffman, and further in view of
Chen or Ho. Claim 32 stands rejected under § 103(a) as
obvious over Yamaha in view of Thomas and Gardner, further in
1A copy of the translation prepared by the U.S. Patent and
Trademark Office is attached.
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