Appeal No. 1999-1454 Page 8
Application No. 08/596,343
circuit wiring board. The admitted prior art also refers (id.)
to heat radiating plates and a cooling fan.
The examiner asserts (answer, page 3) that Hosen teaches
(Figure 3) a related prior art device which includes element 2
requiring high thermal dissipation as well as element 3
requiring less thermal dissipation. Hosen discloses (Figure
2) that the prior art of Figure 3 may be improved by using a
two-level approach wherein power chip element 2 requiring high
thermal dissipation are placed on a lower metal plate
structure 1, and control circuit element 3 requiring less
thermal dissipation are placed upon an upper substrate 8.
According to the examiner, (answer, page 4)
It would have been obvious . . . to dispose the
elements described by appellant [sic] as conventional
in the manner taught by Hosen (i.e. with the elements
requiring high thermal dissipation, e.g. power
supply and CPU, on the lower metal plate with the
remaining elements on an upper substrate) because
Hosen teaches that such an arrangement is an
improvement over the prior art single-layer approach
as it results in a smaller package without a decrease
in thermal dissipation.
The examiner notes (id.) that Hosen does not specifically
disclose that the upper substrate 8 is a multi-layer circuit
wiring board. To overcome this deficiency in Hosen, the
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