Appeal No. 1999-1454 Page 9
Application No. 08/596,343
examiner relies upon Lin for a teaching of using a multi-layer
circuit wiring board "to electrically connect vertically
disposed elements."
Appellants assert (brief, page 7) that the power chip 2
of Hosen does not include a CPU power converter, and that
Hosen does not disclose or suggest that the metal board,
rather than the multi-layer circuit wiring board has the CPU
power converter. Appellants further assert (reply brief, page
1) that "Hosen does not provide any teaching or motivation to
move the CPU power converter from its location in the
appellants' admitted prior art to its location as recited in
present claim 1."
We find that even though the admitted prior art refers to
the use of heat radiating plates and a cooling fan, we find no
suggestion in the admitted prior art recognizing any problem
with having all of the components in a single multi-layer
circuit wiring board. We additionally find that Hosen (page
1) is directed to "a structure of a power semiconductor device
used for a power transistor module which may be applied to an
inverter device." Hosen discloses (pages 1 and 2) that in the
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