Appeal No. 1999-1454 Page 12
Application No. 08/596,343
Accordingly, we see no reason, and no persuasive reason
has been provided by the examiner, as to why one of ordinary
skill in the art would have been motivated or taught to have
modified the admitted prior art by moving the power converter
and CPU of the admitted prior art to a lower metal plate with
the remaining elements on an multi-layer circuit wiring board
as advanced by the examiner.
Moreover, even if we made the proposed modifications
advanced by the examiner, the limitations of claim 1 would not
have been met. Claim 1 recites that the CPU chip is
electrically connected to the multi-layer circuit wiring
board, between the metal board and the multi-layer circuit
wiring board. Claim 1 additionally recites "a control section
electrically connected to said multi-layer circuit wiring
board, on a surface opposite to the CPU chip provided on said
multi-layer circuit wiring board." We find that the language
requires that the CPU chip is provided on the multi-layer
circuit wiring board. The examiner's proposed modification
(answer, page 4) that the CPU and power supply be disposed on
the lower metal plate, with the remaining elements on the
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