Appeal No. 1999-1454 Page 13
Application No. 08/596,343
upper substrate, is inconsistent with the language of claim 1.
The examiner's proposed removal of the CPU chip from the
multi-layer circuit wiring board is contrary to the language
of claim 1 that the CPU chip is provided on the multi-layer
circuit wiring board. Accordingly, we find that the
examiner's proposed modification of the prior art would result
in a structure that is inconsistent with the limitations of
claim 1.
Moreover, even if the proposed modification were made, we
find Hosen would only suggest moving the power supply (CPU
power converter) to the lower plate. The CPU chip would still
remain on the multi-layer circuit wiring board. We find no
suggestion that the CPU chip be selected for placement on an
opposite side of the multi-layer circuit wiring board. We are
cognizant that the admitted prior art teaches that the
components can be on both sides of the multi-layer circuit
wiring board. However, we would have to resort to speculation
to find that the admitted prior art suggests that the CPU chip
would be on one side of the multi-layer circuit wiring board
and least some of the control elements would be in the other
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