Ex Parte Withers et al - Page 5




              Appeal No. 2005-1011                                                                 Page 5                
              Application No. 09/921,588                                                                                 



                     With this as background, we analyze the prior art applied by the examiner in the                    
              rejection of the independent claims on appeal.                                                             


              Kimura                                                                                                     
                     Kimura 's invention relates in general to a polishing apparatus, and more                           
              particularly to a polishing apparatus for producing a flat mirror polished surface on an                   
              object such as a semiconductor wafer.  The object of Kimura's invention was to provide                     
              a polishing apparatus which can produce uniform polishing action across the polished                       
              surface of an object such as a semiconductor wafer so as to achieve a uniformly flat                       
              and mirror polished finish on the object.  Kimura teaches that such object is achieved                     
              according to his invention by providing a polishing apparatus for polishing a surface of                   
              an object and including a turntable having a polishing cloth mounted on an upper                           
              surface thereof, a top ring for holding and pressing the object against the polishing                      
              cloth, and a plurality of radially arranged nozzles for supplying a polishing solution,                    
              containing abrasive material, of different concentrations differing along a radial direction               
              of the polishing cloth.                                                                                    


                     According to a first embodiment of Kimura (see Figures 1-2), polishing solutions                    
              of different concentrations are supplied through the radially arranged nozzles disposed                    
              above the polishing cloth.  Therefore, the apparatus allows fine tuning of the rate of                     







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