Appeal No. 2005-1011 Page 7
Application No. 09/921,588
possible to maintain a desired degree of dilution of the polishing solution on the
polishing cloth.
Figure 8 shows a third embodiment of Kimura. In this embodiment, the
apparatus is provided with a solution supply nozzle 19 for supplying solution supplied
from a solution mixing unit 18, and a water supply nozzle 20 for supplying water
containing a dispersion agent supplied from a dispersion agent mixing unit 17. In the
dispersion agent mixing unit 17, any desired mixing ratio of a dispersion agent and
water may be produced. Both the solution supply nozzle 19 and the water supply
nozzle 20 are equipped with respective needle valves to enable adjustment of the
supply volume. Therefore, by adjusting the degree of opening of the needle valve
appropriately, the dispersion agent or polishing solution can be diluted to any desired
concentration, and desired concentrations of the dispersion agent and the polishing
solution can be retained on the polishing cloth. When the concentration of the
dispersion agent is high, a uniformly polished wafer may be obtained using only two
nozzles. However, while only two nozzles are illustrated, Kimura teaches that it is
permissible to provide several nozzles as in the case of the second embodiment shown
in Figures 3 and 4. Kimura provides that especially, when the concentration of
dispersion agent is low, it is better to provide several radially arranged nozzles.
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Last modified: November 3, 2007