Appeal No. 2005-2558
Application No. 10/408,149
We determine that this issue is not relevant because, as stated,
supra, while Schar states that the method “ought to be lead-free”
(and, assuming, arguendo, that the bumps on the LGA disclosed in
Schar cannot be considered to fall under the definition of a
“lead”), such would not dissuade one skilled in the art from
using a plurality of leads in place of bumps in a method of
making an electronic package, especially in view of the teachings
of Bearinger (discussed further below).
Bearinger teaches a chip connection including a chip and
substrate and a conductive adhesive. See Figure 2 of Bearinger.
Figure 2 shows an interconnect (lead) on a substrate. The
conductive adhesive element is located between one of the
plurality of contact pads (bond pad) and the corresponding lead
(interconnect). Figure 3A also shows an embodiment having a
substrate, pad, contact adhesive, and balls, on a chip. The
balls correspond to leads. Figure 3B shows the adhesive is
located between the pad and the lead. Appellants do not dispute
that the configuration taught by Bearinger meets the claim
limitations in claim 26 and claim 35 regarding the plurality of
leads and the location of the conductive adhesive element.
With regard to other aspects of appellants’ claimed subject
matter, beginning on page 4 of the answer, the examiner states
that Schar teaches attaching a second substrate while the
brief, which we have fully considered.
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