Appeal No. 2005-2558
Application No. 10/408,149
APPENDIX
26. A method for mounting a component including a plurality of
leads on a substrate including a plurality of contact pads such
that each contact pad corresponds to at least one of the
plurality of leads, the method comprising the following steps
performed in the indicated order:
a) applying a plurality of conductive adhesive elements
such that each conductive adhesive element is on each contact
pad;
b) aligning the component with the substrate such that each
lead is juxtaposed with its corresponding conductive adhesive
element and each conductive adhesive element is located between
one of the plurality of contact pads and its corresponding at
least one lead; and
c) performing a partial cure of the conductive adhesive
elements, the partial cure of the conductive adhesive elements
providing temporary mechanical connections that affix the
plurality of contact pads to their corresponding leads while
allowing for adjustment in relative positions of the plurality of
contact pads and their corresponding leads such that electrical
connections suitable for testing are provided between the
plurality of contact pads and their corresponding leads.
27. The method of claim 26, wherein performing the partial cure
of the conductive adhesive elements comprises heating each of the
conductive adhesive elements.
28. The method of claim 27, wherein heating each of the
conductive adhesive elements is performed at 50 to 105°C for 10
minutes to 1 hour.
29. The method of claim 26, wherein performing the partial cure
of the conductive adhesive elements comprises radiatively
exposing each of the conductive adhesive elements.
30. The method of claim 26, wherein performing the partial cure
of the conductive adhesive elements comprises chemically exposing
each of the conductive adhesive elements.
31. The method of claim 26, further comprising the following
steps in the indicated order, after the step of performing a
partial cure:
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