Appeal No. 2005-2558
Application No. 10/408,149
mechanical connections that affix the plurality of contact pads
to their corresponding leads while allowing for adjustment in
relative positions of the plurality of contact pads and their
corresponding leads such that electrical connections suitable for
testing are provided between the plurality of contact pads and
their corresponding leads.
36. The method of claim 35, wherein performing the partial cure
comprises heating each of the conductive adhesive elements
throughout each of the conductive adhesive elements while each
conductive adhesive element is on its respective contact pad and
is not in mechanical contact with the component.
37. The method of claim 36, wherein heating each of the
conductive adhesive elements is performed at 50 to 105°C for 10
minutes to 1 hour.
38. The method of claim 35, wherein performing the partial cure
comprises radiatively exposing each of each if the conductive
adhesive elements throughout each of the conductive adhesive
elements while each conductive adhesive element is on its
respective contact pad and is not in mechanical contact with
component.
39. The method of claim 35, wherein performing the partial cure
comprises chemically exposing each of each of the conductive
adhesive elements throughout each of the conductive adhesive
elements while each conductive adhesive element is on its
respective contact pad and is not in mechanical contact with the
component.
40. The method of claim 35, wherein the substrate comprises a
circuit board.
41. The method of claim 35, further comprising:
testing the component and determining whether the component
is defective or misaligned;
replacing the component, if defective, with a new component
and adjusting the position of or repositioning the component, if
misaligned; and
performing a full cure of the conductive adhesive elements
throughout each adhesive element, the full cure of the conductive
adhesive elements providing permanent fixed mechanical and
electrical connections between the plurality of contact pads and
their corresponding leads.
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