Appeal No. 2005-2558
Application No. 10/408,149
see no criticality regarding the order of these steps. As
pointed out by the examiner at the bottom of page 5 of the
answer, Mase teaches applying an adhesive, followed by mounting
of a chip, followed by partially curing the adhesive. Whether
the adhesive is partially cured before the chip is mounted, or
after the chip is mounted, the result is a chip attached to a
substrate by a partially cured adhesive. As stated, supra, Schar
teaches that a partially cured adhesive allows for testing and
repair to be performed at all stages prior to final and complete
curing. In this regard, we agree with the examiner’s statements
made in the paragraph bridging pages 12-13 of the answer.
In view of the above, we affirm the rejection of claims 26,
34, 35 and 40.
Claims 31 and 41
On page 14 of the brief, appellants argue that Schar in view
of Bearinger and Mase do not teach or suggest the features of
claims 31 and 41 regarding “determining whether the component is
defective or misaligned” and “replacing the component, if
defective, with a new component and adjusting the position of or
repositioning the component, if misaligned.” We disagree. On
page 14 of the answer, the examiner explains how Schar teaches
testing while the substrates are adhered with the partially cured
adhesive and repairing if necessary, and refers to column 3,
lines 35-39 and 59-65. We agree with the examiner that testing
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