Appeal No. 2005-2558
Application No. 10/408,149
d) testing the component and determining whether the
component is defective or misaligned;
e) replacing the component, if defective, with a new
component and adjusting the position of or repositioning the
component, if misaligned; and
f) performing a full cure of the conductive adhesive
elements, the full cure of the conductive adhesive elements
providing permanent fixed mechanical and electrical connections
between the plurality of contact pads and their corresponding
leads.
32. The method of claim 31, wherein the step of performing a
full cure comprises heat curing the conductive adhesive elements
at 50 to 200°C for 15 seconds to 12 hours.
33. The method of claim 31, wherein additional conductive
adhesive elements are applied before replacing the new component
on the substrate and before repositioning the misaligned
component to its correct position such that each additional
conductive adhesive element is on each contact pad.
34. The method of claim 26, wherein the substrate comprises a
circuit card.
35. A method for mounting a component including a plurality of
leads on a substrate including a plurality of contact pads such
that each contact pad corresponds to at least one of the
plurality of leads, the method comprising the following steps
performed in the indicated order:
applying a plurality of uncured conductive e adhesive
elements such that each conductive adhesive element is on each
contact pad and is not in mechanical contact with the component;
aligning the component with the substrate such that each
lead is juxtaposed with its corresponding conductive adhesive
element and each conductive element is located between one of
plurality of contact pads and its corresponding at least one
lead; and
after said applying and aligning steps, performing a partial
cure throughout each of the conductive adhesive elements while
each conductive adhesive element is on its respective contact pad
and is not in mechanical contact with the component, the partial
cure of the conductive adhesive elements providing temporary
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