Appeal No. 2005-2558
Application No. 10/408,149
42. The method of claim 41, wherein performing the full cure
comprises heat curing the conductive adhesive elements at 50 to
200°C for 15 seconds to 12 hours.
43. The method of claim 41, wherein additional conductive
adhesive elements are applied before replacing the new component
on the substrate and before repositioning the misaligned
component to its correct position such that each additional
conductive adhesive element is on each contact pad.
44. The method of claim 41, wherein performing the full cure
comprises heating each of the conductive adhesive elements.
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