Ex Parte Davis et al - Page 6



         Appeal No. 2005-2558                                                       
         Application No. 10/408,149                                                 
         conductive adhesive is in an uncured or partially cured state, to          
         allow for testing and repair that can be performed at all stages           
         prior to final and complete curing.  See column 3, at lines 35-39          
         of Schar.  Answer, page 4.  On page 5 of the answer, the examiner          
         states that Schar is silent regarding the step of partially                
         curing the adhesive after mounting the second substrate.  The              
         examiner refers to Mase for teaching this aspect of the claimed            
         invention.                                                                 
              Beginning on page 8 of the reply brief, appellants argue              
         that because Schar teaches that Schars’ invention provides for             
         easy and flexible testing during all stages of assembly, there             
         would be no reason to modify Schar according to Mase because               
         Schar does not need such modification to achieve flexible testing          
         during all stages of assembly.  We are not convinced by this               
         argument for the following reasons.                                        
              Schar teaches that the conductive adhesive can be partially           
         cured and the second substrate is attached.  See column 3, lines           
         35-39.  One of ordinary skill in the art would appreciate that             
         this could be achieved by applying the conductive adhesive in an           
         uncured state, followed by a step of partially curing the                  
         conductive adhesive, followed by attachment of the second                  
         substrate.  Alternatively, this could be achieved by applying the          
         conductive adhesive in an uncured state, attaching the second              
         substrate, and then partially curing the conductive adhesive.  We          
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