Appeal 2007-2460
Application 10/709,179
[2] forming at least a bump pad on the backside of the chip; and [3] forming
a bump on the bump pad. (Appeal Br. Claims Appendix, Independent Claim
15).
2) ASE’s specification states that its invention provides a method of
fabricating bumps on the backside of a chip. (‘179 Specification, ¶ 13).
3) ASE’s specification teaches that a metallic layer is formed on the
backside of a chip and the metallic layer is patterned to form a bump pad.
(Id.).
4) ASE’s specification states that its bumps are attached to the metallic
bump pads. (Id.).
B. The Prior Art
1. Ono, U.S. Pub. 2003/0107129
5) Ono is directed to method for fabricating a resin encapsulated
semiconductor device. (Ono, Abstract).
5
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