Appeal 2007-2460
Application 10/709,179
bonding pads and polymerizing a protecting layer in situ over the active
surface. (Appeal Br. at 7 summarizing Akram).
3. Koh, U.S. Pub. 2004/0135266
12) Koh describes a substrate of non-electrically conducting material for
mounting a semiconductor chip. (Koh, Abstract).
C. The Examiner’s Answer
13) The Examiner found that Ono describes a method of fabricating
bumps on a chip. (Answer, p. 3).
14) The Examiner found that one of ordinary skill in the art in the
semiconductor packaging art would understand that a metal connection pad
that electrically connects a bump to a chip is usually called a bump pad. (Id.
at 6).
15) The Examiner found that Ono describes forming a bump pad structure
on the backside of the chip as the first and second interconnect and through
hole form a structure that electrically connects Ono’s chip and metal bump.
(Id.).
D. The Appeal Brief and Reply Brief.
16) ASE’s Appeal Brief identifies claim 15 as representative of the claims
on appeal as follows:
8
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Next
Last modified: September 9, 2013