Appeal 2007-2460
Application 10/709,179
Scope of Claim 15
We provide claims with their broadest reasonable interpretation
consistent with the specification. The Examiner states that bump pads
are known in the art as structures that provide electrical connections
between devices. This definition is consistent with ASE’s
specification, which identifies its bump pad as a metallic layer that
connects a bump to the backside of a semiconductor chip. (‘179
Specification, ¶ 13). We find no error in the Examiner’s construction
of the term “bump pad” as meaning structures that provide electrical
connections between devices.
Applicability of Ono
ASE argues that one of ordinary skill in the art would not
consider Ono’s first and second interconnects and through holes to be
a bump pad structure. Specifically, ASE states that Ono’s bumps 19
and second interconnect 14 are not physically connected and thus the
interconnect 14 would not be considered a bump pad. (Reply Br. at
8). ASE however, did not dispute that Ono’s first and second
interconnects and through holes define a structure that electrically
connects Ono’s bumps 19 to the backside of Ono’s semiconductor
chip 15. Further, ASE did not provide evidence to support its attorney
argument as to how one ordinary skill in the art would interpret Ono’s
structure that electrically connects bumps to the backside of the chip.
Based upon the record presented, we find that ASE has failed to
establish that one of ordinary skill in the art would fail to understand
that Ono’s first and second interconnects and through holes form a
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