Appeal 2007-2460
Application 10/709,179
6) Ono Figure 2, reproduced below, depicts a semiconductor device
embodiment:
The semiconductor device depicted above includes:
11 First interconnect pattern
12 First dielectric layer
13 Through holes
14 Second interconnect pattern
15 Semiconductor chip
16 Electrodes
17 Bonding wires
18 Encapsulating resin
19 Metallic bumps
20 Adhesive dielectric sheet
(Id., Fig. 2 and ¶ 28).
7) Ono provides the following explanation of what is depicted in Figure
2 of its published application:
Referring to FIG. 2, a semiconductor device according to a first
embodiment of the present invention has a first interconnect
6
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