Appeal 2007-2503
Application 10/225,978
independent claims also require that at least one bond wire extend from at
least one substantially homogeneous bump. Independent claim 1 is
representative of the appealed claims and reads as follows:
A bumped semiconductor device, comprising:
at least one semiconductor die having an active surface
and a back surface, the active surface having a plurality of bond
pads thereon exposed through respective apertures in a
passivation layer;
at least one substantially homogeneous bump directly
bonded to at least one of the bond pads, the at least one
substantially homogeneous bump comprising a nickel-
containing material having an outside lateral boundary
substantially coincident with the lateral boundary of the
aperture in the passivation layer, having a substantially planar,
exposed surface, and extending at least to an elevation of an
outer surface of the passivation layer; and
at least one bond wire extending from the at least one
substantially homogeneous bump.
(Appeal Br., Claims Appendix).
The Examiner has set forth two prior art rejections. The rejections are
as follows:
i) Claims 1, 3-22, 24-40, 42-47 and 75-85 are rejected
under 35 U.S.C. § 103(a) as being unpatentable over
Asazu, U.S. 2001/0017412 (“Asazu”),
Shinogi, U.S. Pat. 6,479,900 (“Shinogi”),
Walker, U.S. Pat. 6,534,863 (“Walker”),
Iwasaki, U.S. Pat. 5,892,273 (“Iwasaki”) and
Shibasaki, U.S. Pat. 4,908,685 (“Shibasaki”).
ii) Claims 86-89 are rejected under 35 U.S.C. § 103(a) as
being unpatentable over Asazu, Shinogi, Walker, Iwasaki,
Shibasaki and further in view of Anderson, U.S. Pat. 4,495,222
(“Anderson”).
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