Appeal 2007-2503
Application 10/225,978
bond pads with nickel-containing bumps. In particular, the Examiner found
that Asazu describes a semiconductor die having a plurality of bond pads
with substantially homogeneous, nickel-containing bumps having gold over
the nickel. (Anwer at 3-4). While Asazu states that conductor leads are
attached to its bumps, the Examiner found that one of ordinary skill in the art
would have been guided to protect the device by employing an encapsulated
wire, such as that described by Shibasaki, in place of the conductor leads
(Id.).
Micron contends that Asazu fails to teach or suggest at least one bond
wire extending from the substantially homogeneous bump. Micron states
that leads and bond wires are not known equivalents in the art and that there
is no reasonable expectation of success using bond wires to connect Asazu’s
device. (Appeal Br. at 11-12). The Examiner disagrees stating that one of
ordinary skill in the art would recognize such an equivalence as both Asazu
and Shibasaki connect similar bump configurations on their respective chips.
(Answer at 7-8). Micron did not respond to this Examiner finding in its
Reply Brief and Micron’s Appeal Brief did not identify evidence to support
its contention. Based upon the record presented, we find that Micron has
failed to establish that one of ordinary skill in the art would fail to
understand that encapsulated wire bonds could be used in place of the
conductor leads of Asazu. Rohm & Haas Co. v. Brotech Corp., 127 F.3d
1089, 1092, 44 USPQ2d 1459, 1462 (Fed. Cir. 1997)(Nothing in the rules or
in jurisprudence requires trier of fact to credit unsupported or conclusory
assertions).
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