Appeal 2007-2503
Application 10/225,978
Has Micron demonstrated that the Examiner was incorrect in
finding that one of ordinary skill in the art would have had
reason to form a semiconductor device with a wire bond
extending from a substantially homogeneous bump comprising
a nickel-containing material?
FINDINGS OF FACT
A. Applicant’s ‘978 Specification
1) Micron’s claims on appeal are directed to bumped semiconductor
devices, wafers, semiconductor device assemblies and electronic systems.
(Appeal Br., Claims Appendix).
2) Micron’s claims on appeal require a substrate having an active surface
and a back surface where the active surface has a plurality of bond pads
where at least one substantially homogeneous bump comprising a nickel-
containing material is directly bonded to a bond pad. (Id.).
B. The Prior Art
1. Asazu, U.S. Pat. U.S. 2001/0017412 (“Asazu”),
3) Asazu describes semiconductor devices having electrode pads on a
semiconductor chip surface. (Asazu, Abstract).
4) Nickel plated bumps are placed on Asazu’s electrode pads and the
surface of the bump is coated with gold plating as a metal film. (Id.).
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