Appeal 2007-2503
Application 10/225,978
Micron contends that Shibasaki fails to teach or suggest a bond wire
extending from a substantially homogeneous bump. Obviousness however,
is not limited to the express teachings of a single prior art reference but is
based upon what the combined teachings of the prior art suggest to the
person of ordinary skill in the art. In re Keller, 642 F.2d 413, 425, 208
USPQ 871, 881 (CCPA 1981). Here, Asazu suggests forming a
semiconductor device with substantially homogeneous nickel-containing
bumps and Shibasaki suggests using encapsulated bond wires connected to
bumps to protect the device. (Answer at 4-5, see also Shibasaki, Fig. 4).
Accordingly, the record supports the Examiner’s finding that the prior art
provides a reason for connecting the bump of Asazu to an encapsulated bond
wire, i.e., connect the bump to an encapsulated bond wire to protect the
device.
Micron states that Asazu’s conductor leads are bonded to bumps via
an Au/Sn eutectic alloy having a thickness of 0.09 to 0.19 microns. (Appeal
Br. at 12). Micron contends that bond wires do not have a Sn layer 0.09 to
0.19 microns thick and would not form an Au/Sn eutectic alloy if bonded to
the electroless Ni plated bumps of Asazu. (Id.). A person of ordinary skill
in the art is not an automaton and is capable of connecting a bump to a bond
wire. Specifically, bond wires are known in the art as are nickel-containing
metal bumps that have a gold covering to prevent the oxidation of the nickel.
Micron does not dispute the Examiner’s underlying contention that one of
ordinary skill in the art had sufficient skill to connect the known bond wires
to the known metal bumps. We find Micron has failed to demonstrate that a
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