Appeal 2007-2503
Application 10/225,978
5) Asazu’s bumps have a substantially planar, exposed surface, and
extend at least to an elevation of an outer surface of the passivation layer.
(Asazu, e.g., Fig. 3).
6) Asazu describes connecting conductor leads to the bumps. (Id. at
¶ 29).
7) Asazu describes its invention as relating to semiconductor devices,
and in particular, relating to semiconductor devices suitable for tape carrier
packages and the like. (Id. at ¶ 1).
8) Asazu states that its description of preferred embodiments was made
referring to an example of a tape carrier package, but that the invention can
be applied to semiconductor devices having no device hole, such as chip-on-
films. (Id. at ¶ 34).
2. Shibasaki, U.S. Pat. 4,908,685 (“Shibasaki”)
9) Shibasaki describes a magnetoelectric transducer having a
semiconductor thin film on a substrate and a multilayer wire bonding
electrode formed on an area of the thin film. (Shibasaki, abstract).
10) Shibasaki’s wire bonds are embedded in a resin mold body for
packaging or molding. (Id. at col. 4, ll. 40-48).
6
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